TIP900 Thermal Imaging System for Wallboard Profiling

Quantity: Out Of Stock

Category: Fluke Process Instruments

Quick Overview:

Key Features 
Complete turnkey industrially designed hardware & software system for wallboard production
User-friendly software with clear graphical overview on a single screen
Detailed continuous board quality monitoring
Real-time detection of bubbles, blisters and clumps
Failure identification function tracked in database
Automatic live rejection of defective boards
Database LogViewer for historical and quality analysis
High resolution thermal imager for accurate infrared images
Complete hardware system configured for harsh environments
Network connectivity for remote communication
Onsite TIP900 system configuration and training of your operators
Accuracy: ±2% of measured value or ±2 ºC (4 ºF), whichever is greater
Temperature Range: 350 ºC max. (662 ºF max.)
Ambient Temperature: 0 to 50 °C (32 to 122 °F)


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Product Overview

The TIP900 system is a comprehensive thermal imaging and noncontact profiling system designed to supervise the temperature of wallboards coming out of the oven. It uses an infrared thermal imager to continuously scan the entire board surface temperatures and allows the detection in real time of moisture and density variations inside each board.

The powerful TIP900 software provides sophisticated data integration, visualization and event analysis, and offers users a complete solution of real-time monitoring, detection and traceability. It also analyzes and provides optimal oven dryer profile balance.

The detailed wallboard quality maps, the historical temperature trend charts and the images can be seen locally at the operator workstation or remotely. All data is stored in the LogViewer database for complete process visibility and long term traceability.

TIP900 System Software

  • Detailed continuous board quality monitoring (100% of all board images are archived)
  • Easy recipe setup – automated scaling
  • Automated board defect detection and rejection
  • Ethernet connectivity: process data, defect reports, dryer balance profile, etc., can be shared with HMI/SCADA
  • Dynamic deck-to-deck dryer profile balance monitoring
  • Failure identification function tracked in database
  • Database LogViewer for historical analysis (for remote access viewing of any TIP900 on a company network)
  • Configurable reject/alarm parameters

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TIP900 Thermal Imaging System for Wallboard Profiling

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